The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. The Evolution of Cool!
Features:
High-Density ceramic content:
Céramique uses a high-density layered composite
of five unique shapes of thermally conductive aluminum oxide, boron
nitride and zinc oxide sub-micron particles to maximize particle-to-particle
contact area and thermal transfer. This exclusive combination provides
performance exceeding most metal based compounds.
Controlled Triple-Phase Viscosity:
Céramique does not contain any silicone.
The suspension fluid is a proprietary mixture of advanced polysynthetic oils that provide superior performance and
long-term stability.
During the system's initial use, the heat from
the CPU lowers the viscosity of the compound to enhance the filling
of the microscopic valleys and ensure a minimum bond line between the
heatsink and the CPU core. Then the compound thickens slightly over
the next 100 to 300 hours of use to its final consistency designed
for long-term stability.
(This should not be confused with
conventional phase change pads that are pre-attached to
many heatsinks. Those pads melt each time they get hot
then re-solidify when they cool. The viscosity changes
that Céramique goes through are much more subtle and ultimately
much more effective.)
Excellent Stability:
Céramique is engineered to not separate, run,
migrate, or bleed.
Electrical Insulator:
Céramique does not contain any metal or other
electrically conductive materials. It is a pure electrical insulator,
neither electrically conductive nor capacitive.
Performance:
2 to 10 degrees centigrade lower CPU full
load core temperatures than standard thermal compounds or thermal pads
when measured with a calibrated thermal diode imbedded in the CPU core.
Easy Clean Up:
Céramique can easily be cleaned from CPUs
and heatsinks with isopropyl alcohol or any of the cleaners listed
in the product
instructions.
Innovative Dispenser:
The 2.5-gram Céramique is the first product
available in our proprietary thermal compound syringe. Our new syringe
is more compact, easier to handle and dispenses a higher percentage
of its content than standard industrial or medical syringes. The amount
of compound remaining in the syringe is easy to determine as the rear
of the plunger is perfectly flush with the flange when the syringe
is empty.
<Compliancy:
RoHS Comliant.
Specifications:
Thermal Resistance:
<0.007°C-in2/Watt (0.001 inch
layer)
Thermal Conductance:
>200,000W/m2.°C (0.001 inch
layer)
Average Particle Size:
<0.38 microns <0.000015 inch
( 67 particles lined up in a row equal 1/1000th of an inch. )
Temperature limits:
Peak: –150°C to >180°C Long-Term: –150°C
to 125°C
Coverage Area:
2.5-gram syringes. (About 1cc)
At a layer 0.003" thick, one tube will cover approximately 20 square
inches.
22-gram syringes. (About 8cc)
At a layer 0.003" thick, one tube will cover approximately 160 square
inches.
Important Reminder:
Due to the unique shapes and sizes of the particles in Céramique, it will take a minimum of 25 hours and several thermal cycles to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the heatsink.) On systems measuring actual internal core temperatures via the CPU's internal diode, the measured temperature will often drop slightly over this "break-in" period. This break-in will occur during the normal use of the computer as long as the computer is turned off from time to time and the interface is allowed to cool to room temperature. Once the break-in is complete, the computer can be left on if desired.